Zhubei, Taiwan

Chia-Hsiang Lin

This inventor holds 18 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Lite-On It Corporation, Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2007-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia-Hsiang Lin. Retrieved from https://idiyas.com/inventor/chia-hsiang-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 61.1

Average Co-Inventor Count = 4.2

ph-index = 3

Forward Citations = 33(Granted Patents)


Location History:

  • Hsinchu, TW (2007 - 2012)
  • Hsinchu, JP (2012)
  • Hsinchu County, TW (2020 - 2022)
  • Zhubei, TW (2013 - 2023)

Company Filing History:


Years Active: 2007-2026

Loading Chart...
Areas of Expertise:
Stress Reduction
Package Structure
Interconnects
3D Integrated Circuit
Multi Fan-Out
Lithography
Gap-Filling Material
Overlay Measurement
Via Filling Uniformity
Digital Recording
Reproducing Apparatus
18 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Chia-Hsiang Lin

Introduction: Chia-Hsiang Lin, an esteemed inventor located in Zhubei, Taiwan, has made remarkable contributions to the field of semiconductor technology. With an impressive portfolio of 16 patents, he has developed innovative methodologies and structures that play a crucial role in modern electronics.

Latest Patents: Among his notable patents, Lin's latest inventions include "Eccentric via structures for stress reduction" and "Package structure with reinforced element." The first patent outlines a method for forming dielectric layers and redistribution lines that enhance the reliability of electronic devices. It involves intricate steps such as patterning the dielectric layer, forming vias, and depositing conductive materials to create robust electrical connections.

The second patent discusses a package structure that integrates a reinforced plate with various conductive structures and a redistribution structure. This innovation is aimed at improving the longevity and performance of electronic chips by providing effective support and protection.

Career Highlights: Chia-Hsiang Lin has had a significant impact on the semiconductor industry through his work with leading companies. He has been associated with Taiwan Semiconductor Manufacturing Company Limited and Lite-On IT Corporation, where he contributed to advancements in technology and product development. His continuous pursuit of innovation has established him as a key figure in the field.

Collaborations: Throughout his career, Lin has collaborated with notable professionals, including Shin-Puu Jeng and Po-Yao Lin. These partnerships have enabled him to leverage diverse expertise and insights, further enhancing the quality and applicability of his inventions.

Conclusion: Chia-Hsiang Lin stands as a prominent inventor whose work in the semiconductor field underscores the importance of innovation in technology. With 16 patents to his name and ongoing contributions to the industry, his inventions not only exemplify creativity but also address critical needs in modern electronic design and functionality.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…