Chi-Ruei Yeh

Title: Chi-Ruei Yeh: Innovator in Semiconductor Technology

Introduction

Chi-Ruei Yeh is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work focuses on enhancing the efficiency and performance of semiconductor devices.

Latest Patents

One of his latest patents is titled "Barrier layer for contact structures of semiconductor devices." This patent describes a semiconductor device featuring a diffusion barrier layer on source/drain (S/D) contact structures. The method of fabricating this semiconductor device includes forming a S/D region on a fin structure, creating a S/D contact structure with a metal on the S/D region, and applying a barrier layer that blocks the diffusion of the metal in the S/D contact structure to the via contact structure.

Another notable patent is "Semiconductor structure including isolation structure with dielectric stack and method of forming the same." This patent outlines a method for manufacturing a semiconductor structure, which involves providing a substrate, forming a fin structure, and creating a dielectric stack in a trench that penetrates the first dummy gate and the fin structure. The process ensures the formation of a protective layer directly on the lower portion of the dielectric stack.

Career Highlights

Chi-Ruei Yeh is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His innovative work has positioned him as a key player in advancing semiconductor technologies.

Collaborations

Throughout his career, Chi-Ruei has collaborated with notable colleagues, including Tsung-Yu Chiang and Kang-Min Kuo. These partnerships have contributed to the development of cutting-edge semiconductor solutions.

Conclusion

Chi-Ruei Yeh's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to impact the industry positively, paving the way for future innovations.