The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2024

Filed:

Apr. 22, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Hsinhsiang Tseng, Hsinchu, TW;

Chi-Ruei Yeh, Hsinchu, TW;

Tsung-Yu Chiang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/535 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/535 (2013.01); H01L 21/0217 (2013.01); H01L 21/76805 (2013.01); H01L 21/76831 (2013.01); H01L 21/76895 (2013.01); H01L 23/53214 (2013.01); H01L 23/53228 (2013.01); H01L 23/53242 (2013.01); H01L 23/53257 (2013.01); H01L 23/5329 (2013.01);
Abstract

A semiconductor device includes a gate structure disposed in a first dielectric layer, a conductive segment disposed in the first dielectric layer and separated from the gate structure, a second dielectric layer disposed over the first dielectric layer, a first contact penetrating the second dielectric layer and electrically connected to the gate structure, a second contact penetrating the second dielectric layer and electrically connected to the conductive segment, and a silicon nitride-based layer surrounding at least one of the first and second contacts and connected between the second dielectric layer and the at least one of the first and second contacts. A method for making the semiconductor device is also provided.


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