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Chi-Lin Teng

This inventor holds 48 USPTO granted patents and 23 published patent applications, primarily in Semiconductor Technology. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2014-2026.

USPTO Granted Patents = 48 (Patent Applications = 23)

% Patents Active = 91.7

Average Co-Inventor Count = 6.1

ph-index = 4

Forward Citations = 47(Granted Patents)

Location History:

Taichung, TW (2014 - 2024)
Hsinchu, TW (2024)

Company Filing History:

48 out of 42,711

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2014-2026

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Areas of Expertise:

Semiconductor Structure

Interconnect Structure

Air Gap

Thermal Management

Metallization Layer

Dielectric Capping

Low Capacitance

3D Stacking

Electrical Interconnect

Manufacturing Methods

Composite Materials

High Performance

48 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12685126 - Interconnect structure (2026-07-14),

2. 12593673 - Semiconductor structure and method making the same (2026-03-31),

3. 12564045 - Semiconductor device structure with interconnect structure having air gap (2026-02-24),

4. 12538773 - Semiconductor structure having self-aligned conductive structure and method for forming the semiconductor structure (2026-01-27),

5. 12482703 - Semiconductor device having thermally conductive air gap structure and method for manufacturing the same (2025-11-25),

6. 12463134 - Semiconductor interconnection structure and methods of forming the same (2025-11-04),

7. 12431386 - Semiconductor device having metallization layer with low capacitance and method for manufacturing the same (2025-09-30),

8. 12412780 - Semiconductor device structure and methods of forming the same (2025-09-09),

9. 12381113 - Semiconductor device structure having air gap and methods of forming the same (2025-08-05),

10. 12230537 - Semiconductor device structure having air gap and methods of forming the same (2025-02-18),

11. 12176247 - Metal oxide composite as etch stop layer (2024-12-24),

12. 12176246 - Dielectric capping structure overlying a conductive structure to increase stability (2024-12-24),

13. 12165945 - Thermal interconnect structure for thermal management of electrical interconnect structure (2024-12-10),

14. 12094764 - Interconnect structure and methods of forming the same (2024-09-17),

15. 12068248 - Semiconductor interconnection structure and methods of forming the same (2024-08-20),

Title: Chi-Lin Teng: Pioneering Inventor from Taichung

Introduction: Chi-Lin Teng is a distinguished inventor hailing from Taichung, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chi-Lin Teng holds several patents in the areas of electronics, renewable energy, and sustainable technologies, showcasing his commitment to creating solutions for a better future.

Career Highlights: With a career spanning over two decades, Chi-Lin Teng has worked with leading tech companies, research institutions, and universities, where he has spearheaded projects that have revolutionized the industry.

Collaborations: Throughout his career, Chi-Lin Teng has collaborated with top engineers, scientists, and researchers globally, fostering a culture of innovation and knowledge exchange that has led to remarkable advancements in various fields.

Conclusion: Chi-Lin Teng's passion for innovation, coupled with his relentless drive to push the boundaries of technology, has solidified his position as a visionary inventor shaping the landscape of tomorrow.

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