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For the Inventor, By the Inventor

Taichung, Taiwan

Chi-Lin Teng

USPTO Granted Patents = 44 

Average Co-Inventor Count = 6.0

ph-index = 3

Forward Citations = 30(Granted Patents)


Location History:

  • Taichung, TW (2014 - 2024)
  • Hsinchu, TW (2024)

Company Filing History:

goldMedal44 out of 40,780 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2014-2025

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Areas of Expertise:
Semiconductor Device
Thermally Conductive Air Gap
Interconnect Structure
Dielectric Capping Structure
Thermal Management
Metal Oxide Composite
Air Gate Spacer
Low Capacitance Metallization
Electrical Interconnect
High Performance Interconnects
Spin-On Metal Oxide Deposition
Protecting Layer
44 patents (USPTO):Explore Patents
1. 12482703 - Semiconductor device having thermally conductive air gap structure and method for manufacturing the same (2025-11-25),
2. 12463134 - Semiconductor interconnection structure and methods of forming the same (2025-11-04),
3. 12431386 - Semiconductor device having metallization layer with low capacitance and method for manufacturing the same (2025-09-30),
4. 12412780 - Semiconductor device structure and methods of forming the same (2025-09-09),
5. 12381113 - Semiconductor device structure having air gap and methods of forming the same (2025-08-05),
6. 12230537 - Semiconductor device structure having air gap and methods of forming the same (2025-02-18),
7. 12176247 - Metal oxide composite as etch stop layer (2024-12-24),
8. 12176246 - Dielectric capping structure overlying a conductive structure to increase stability (2024-12-24),
9. 12165945 - Thermal interconnect structure for thermal management of electrical interconnect structure (2024-12-10),
10. 12094764 - Interconnect structure and methods of forming the same (2024-09-17),
11. 12068248 - Semiconductor interconnection structure and methods of forming the same (2024-08-20),
12. 12068193 - Semiconductor device structure with interconnect structure having air gap (2024-08-20),
13. 12062572 - Semiconductor device having metallization layer with low capacitance and method for manufacturing the same (2024-08-13),
14. 12033889 - Semiconductor device structure and methods of forming the same (2024-07-09),
15. 12027606 - Semiconductor devices with air gate spacer and air gate cap (2024-07-02),

Title: Chi-Lin Teng: Pioneering Inventor from Taichung

Introduction: Chi-Lin Teng is a distinguished inventor hailing from Taichung, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chi-Lin Teng holds several patents in the areas of electronics, renewable energy, and sustainable technologies, showcasing his commitment to creating solutions for a better future.

Career Highlights: With a career spanning over two decades, Chi-Lin Teng has worked with leading tech companies, research institutions, and universities, where he has spearheaded projects that have revolutionized the industry.

Collaborations: Throughout his career, Chi-Lin Teng has collaborated with top engineers, scientists, and researchers globally, fostering a culture of innovation and knowledge exchange that has led to remarkable advancements in various fields.

Conclusion: Chi-Lin Teng's passion for innovation, coupled with his relentless drive to push the boundaries of technology, has solidified his position as a visionary inventor shaping the landscape of tomorrow.

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