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For the Inventor, By the Inventor

Minxiong, Taiwan

Cheng-Ying Ho

This inventor holds 26 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cheng-Ying Ho. Retrieved from https://idiyas.com/inventor/cheng-ying-ho

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26 

% Patents Active = 96.2

Average Co-Inventor Count = 5.3

ph-index = 4

Forward Citations = 61(Granted Patents)


Location History:

  • Chiayi, TW (2014)
  • Chiayi County, TW (2015 - 2023)
  • Minxiong Township, TW (2013 - 2024)

Company Filing History:

goldMedal26 out of 42,926 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2026

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Areas of Expertise:
Back-Trench Isolation
Image Sensor
Stacked Integrated Circuits
3DIC Seal Ring
Hybrid Bonding
Bond Pad Structure
Cross Talk Reduction
Redistribution Lines
CMOS Technology
Semiconductor Device
Barrier Layer
Manufacturing Methods
26 patents (USPTO):Explore Patents
1. 12550473 - Back-trench isolation structure (2026-02-10),
2. 12514009 - Isolation structure configured to reduce cross talk in image sensor (2025-12-30),
3. 12482791 - Stacked integrated circuits with redistribution lines (2025-11-25),
4. 12396283 - 3DIC seal ring structure and methods of forming same (2025-08-19),
5. 11923338 - Stacked integrated circuits with redistribution lines (2024-03-05),
6. 11837595 - Semiconductor device structure and method for manufacturing the same (2023-12-05),
7. 11532661 - 3DIC seal ring structure and methods of forming same (2022-12-20),
8. 11088192 - Metal block and bond pad structure (2021-08-10),
9. 10818720 - Stacked image sensor having a barrier layer (2020-10-27),
10. 10629568 - Stacked integrated circuits with redistribution lines (2020-04-21),
11. 10522525 - Semiconductor device structure (2019-12-31),
12. 10510792 - 3DIC seal ring structure and methods of forming same (2019-12-17),
13. 10297631 - Metal block and bond pad structure (2019-05-21),
14. 10283547 - Stacked image sensor having a barrier layer (2019-05-07),
15. 10269768 - Stacked integrated circuits with redistribution lines (2019-04-23),

Title: Cheng-Ying Ho: Innovator from Minxiong

Introduction: Cheng-Ying Ho is a renowned inventor hailing from Minxiong, Taiwan, known for his groundbreaking contributions to various fields.

Latest Patents: Cheng-Ying Ho holds several patents in the areas of technology and healthcare, showcasing his innovative mindset and problem-solving abilities.

Career Highlights: Throughout his career, Cheng-Ying Ho has worked tirelessly to develop cutting-edge solutions that have significantly impacted industries such as electronics, biotechnology, and renewable energy.

Collaborations: Cheng-Ying Ho has collaborated with leading research institutions, universities, and companies worldwide to bring his inventions to life, demonstrating his ability to work effectively in multidisciplinary teams.

Conclusion: Cheng-Ying Ho's passion for innovation and his dedication to creating a positive change in the world make him a truly inspiring figure in the field of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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