The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Jul. 18, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Cheng-Ying Ho, Minxiong Township, TW;
Wen-De Wang, Minsyong Township, TW;
Kai-Chun Hsu, Yonghe, TW;
Sung-En Lin, Taoyuan, TW;
Yuh-Ruey Huang, Hsinchu County, TW;
Jen-Cheng Liu, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
The present disclosure relates to an image sensor integrated chip (IC). The image sensor IC includes one or more interconnects arranged within an inter-level dielectric (ILD) structure on a first side of a substrate. An image sensing element is arranged within the substrate. Sidewalls of the substrate form one or more trenches extending from a second side of the substrate to within the substrate on opposing sides of the image sensing element. A dielectric structure is arranged on the sidewalls of the substrate that form the one or more trenches. A conductive core is arranged within the one or more trenches and is laterally separated from the substrate by the dielectric structure. The conductive core is electrically coupled to the one or more interconnects.