This inventor holds 22 USPTO granted patents and 11 published patent applications, primarily in Semiconductor Packaging. Top assignees: Flex Ltd., Intel Corporation, Semiconductor Manufacturing International (Shanghai) Corporation. Active years: 2009-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Pudong New Area, CN (2022 - 2023)
- Shanghai, CN (2009 - 2024)
Company Filing History:
6 out of 149 
5 out of 56,322 
4 out of 1,753 
Years Active: 2009-2026
Areas of Expertise:
Title: **Cheng Yang: Innovator and Patent Holder from Shanghai**
Introduction
Cheng Yang is a prominent inventor based in Shanghai, China, known for his significant contributions to technology through a remarkable portfolio of 19 patents. His work spans various domains, showcasing his expertise and innovative spirit.
Latest Patents
Among Cheng Yang's latest innovations are two notable patents. The first patent focuses on "Devices, systems, and methods for stacked die packages." This invention encapsulates a sophisticated package that includes a chip stack, enabling advanced connectivity and performance in electronic devices. The design involves a first chip with bonding structures interacting with a second chip, ensuring optimal space utilization without overlap in structure positioning.
The second significant patent is for a "Ratchet wrench with drive pins." This innovative tool features a unique assembly that incorporates a head, ratchet gear, and yoke, designed for ease of use and efficiency. The ratchet wrench's mechanism allows for seamless rotation and control, making it a valuable addition to any toolkit.
Career Highlights
Cheng Yang has worked with notable companies such as Flex Ltd. and Intel Corporation, where he has honed his skills and contributed to pioneering projects. His tenure at these organizations reflects his commitment to pushing the boundaries of technology and innovation.
Collaborations
Throughout his career, Cheng has collaborated with talented individuals such as Dongkai Shangguan and Junfeng Zhao. These partnerships have enriched his work, leading to the development of groundbreaking technologies and enhancing his contributions to the field.
Conclusion
In summary, Cheng Yang stands out as a prolific inventor whose patents demonstrate his commitment to innovation. His recent works in stacked die packages and ratchet wrenches are just a glimpse of the impactful technologies he continues to develop. With a solid background in reputable companies and collaborations with esteemed colleagues, Cheng is poised to make further advancements in the world of technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile