The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2019
Filed:
Oct. 03, 2014
Intel Corporation, Santa Clara, CA (US);
Junfeng Zhao, Shanghai, CN;
Cheng Yang, Shanghai, CN;
Intel Corporation, Santa Clara, CA (US);
Abstract
Some forms relate to an electronic assembly () that includes a die () that includes an upper surface () and a conductive column () extending from the upper surface () such that the conductive column () is not surrounded by any material other than where the conductive column () engages the die (). Other forms relate to an electronic package () that includes a stack () of electronic assemblies () where each electronic assembly () includes a die () that having an upper surface () and a plurality of conductive columns () extending from the upper surface () such that each conductive column () is not surrounded by any material other than where the conductive column () engages the die (), and wherein the stack () of electronic assemblies () is arranged in an overlapping configuration such the plurality of conductive columns () on each electronic assembly () are not covered by another electronic assembly ().