The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Oct. 30, 2023
Jcet Management Co., Ltd., Shanghai City, CN;
Cheng Yang, Shanghai, CN;
JCET Management Co., Ltd., Shanghai City, CN;
Abstract
The present invention relates to the technical field of chip package, in particular to a semiconductor package injection molding mold, a semiconductor package injection molding device and a semiconductor package injection molding method. The semiconductor package injection molding mold includes a bottom mold and a top mold. The upper surface of the bottom mold is fitted with the lower surface of a substrate to form a semiconductor package structure; the top mold is matched with the bottom mold; the top mold has a cavity; the cavity is oriented toward the upper surface of the substrate and is used to accommodate a plastic package layer formed on the upper surface of the substrate; through holes that penetrate through the bottom mold are formed at positions corresponding to the substrate in the bottom mold; and the through holes are connected with an external pressure source.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile