The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11682603 B1

Date of Patent:

Jun. 20, 2023

Filed:

Mar. 25, 2021

Control of thermal interface material in multi-chip package

Applicant:

Flex Ltd., Singapore, SG;

Inventors:

Cheng Yang, Shanghai, CN;

Dongkai Shangguan, San Jose, CA (US);

Assignee:

Flex Ltd., Singapore, SG;

Attorney:

Sheridan Ross P.C.

Primary Examiner:

Patricia D Valenzuela

Int. Cl.

CPC ...

H01L 23/373 (2006.01); H01L 23/367 (2006.01); H01L 21/66 (2006.01); H01L 21/48 (2006.01); B23K 1/00 (2006.01); H01L 25/065 (2023.01);

U.S. Cl.

CPC ...

H01L 23/373 (2013.01); B23K 1/0008 (2013.01); H01L 21/4882 (2013.01); H01L 22/12 (2013.01); H01L 23/367 (2013.01); H01L 25/0655 (2013.01); H01L 23/3675 (2013.01); H01L 23/3737 (2013.01);

Abstract

An electronic system includes a plurality of heat sources. At least two of the plurality of heat sources vary in height and each of the plurality of heat sources includes a first side and a second side. The electronic system also includes a substrate having a first side and a second side. The second side of each of the plurality of heat sources is positioned adjacent to the first side of the substrate. The electronic system further includes a cover member provided above the plurality of heat sources and a sintering thermal interface material provided between the cover member and the first side of one of the at least two heat sources that vary in height.

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