San Jose, CA, United States of America

Dongkai Shangguan

This inventor holds 34 USPTO granted patents and 6 published patent applications and 4 EPO patents, primarily in Electronic Packaging. Top assignees: Flex Ltd., Ford Motor Company Limited, Visteon Global Technolgoies, Inc.. Active years: 1995-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dongkai Shangguan. Retrieved from https://idiyas.com/inventor/dongkai-shangguan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 34 

% Patents Active = 76.5


Average Co-Inventor Count = 2.6

ph-index = 11

Forward Citations = 324(Granted Patents)


Location History:

  • Novi, MI (US) (1995 - 2001)
  • Livonia, MI (US) (2002)
  • San Jose, CA (US) (2002 - 2023)

Company Filing History:


Years Active: 1995-2025

Loading Chart...
Loading Chart...
Areas of Expertise:
Stacked Die Packages
Solder Compositions
Thermal Interface Material
Camera Module
Flexible Hybrid Electronics
Electronic Encapsulation
Molded Housing
Copper Structure
Microvias
Interconnections
Low-Temperature Solder
Lead-Free Solder
34 patents (USPTO):Explore Patents

Title: Dongkai Shangguan: A Pioneer in Innovation and Patent Creation

Introduction:

Innovation is the driving force behind technological advancements and progress. One individual who has made significant contributions to the field of electronic devices and thermal interface materials is Dongkai Shangguan. With an impressive portfolio of patents and experience working with renowned companies, he has emerged as a pioneer in the industry.

Background Information:

Dongkai Shangguan, based in San Jose, CA, holds an impressive total of 32 patents. His innovative ideas and problem-solving abilities have resulted in remarkable advancements in creating exposed cavities in molded electronic devices and controlling thermal interface materials in multi-chip packages.

Patent Highlights:

One of Shangguan's latest patents revolves around methods of creating exposed cavities in molded electronic devices. These methods involve encapsulation techniques, wherein sensors or emitters are covered, placed in a transfer mold system, encapsulated with charge material, and finally, a portion of the encapsulating material and the cover is removed to expose the sensor or emitter, allowing it to interact with the environment.

Another notable patent is focused on controlling thermal interface materials in multi-chip packages. This invention involves a method of managing heat sources that vary in height within an electronic system. By employing a sintering thermal interface material between a cover member and the heat sources, efficient heat dissipation and overall thermal management are achieved.

Professional Experience:

Throughout his career, Dongkai Shangguan has worked for reputable companies in the industry. He has contributed his expertise to Visteon Global Technologies, Inc. and Flextronics AP, LLC. These collaborations have enabled Shangguan to work alongside talented individuals, fostering an environment of knowledge exchange and innovation.

Collaborators:

Dongkai Shangguan has had the pleasure of working with accomplished colleagues who have likely played a vital role in his successful patents. Some of his notable coworkers include Mohan R Paruchuri and Achyuta Achari. Their collective efforts exemplify the power of collaboration and teamwork within the field of innovation.

Conclusion:

Dongkai Shangguan's contributions to the field of electronic devices and thermal interface materials exemplify the power of innovative thinking and problem-solving. His impressive portfolio of 32 patents, including groundbreaking methods of creating exposed cavities in molded electronic devices and controlling thermal interface materials in multi-chip packages, showcases his commitment to pushing technological boundaries. With his experience in renowned companies and collaborations with accomplished colleagues, Shangguan continues to shape the future of technology through his dedication to innovation and patent creation.

Disclaimer: For more detailed and accurate information about Dongkai Shangguan and his work, please refer to the official patent databases or reliable sources.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…