The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2023
Filed:
Apr. 12, 2022
Applicant:
Flex Ltd, Singapore, SG;
Inventors:
Dongkai Shangguan, San Jose, CA (US);
David Geiger, Dublin, CA (US);
Venkat Iyer, Cupertino, CA (US);
Cheng Yang, Pudong New Area, CN;
Assignee:
FLEX LTD, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0044 (2013.01); H05K 3/0026 (2013.01); H05K 3/284 (2013.01); H05K 2203/025 (2013.01);
Abstract
Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.
Quick Actions:
Shangguan, Dongkai. (2023). Methods of creating exposed cavities in molded electronic devices (U.S. Patent No. 11723151). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11723151
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile