The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Jun. 24, 2019
Applicant:

Flex Ltd., Singapore, SG;

Inventors:

Weifeng Liu, Dublin, CA (US);

William L. Uy, San Jose, CA (US);

Dongkai Shangguan, San Jose, CA (US);

Assignee:

Flex Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/48 (2006.01); H01L 21/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/28 (2006.01); H05K 1/18 (2006.01); H05K 1/14 (2006.01); H01L 21/56 (2006.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01); H05K 1/03 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0281 (2013.01); H01L 21/56 (2013.01); H01L 51/0097 (2013.01); H01L 51/5253 (2013.01); H05K 1/0283 (2013.01); H05K 1/0393 (2013.01); H05K 1/118 (2013.01); H05K 1/147 (2013.01); H05K 1/189 (2013.01); H05K 3/284 (2013.01); H01L 23/3107 (2013.01);
Abstract

Methods, devices, and systems for producing a flexible electronic device that reduces stress and forces on electronic components are provided. In particular, one or more transition layers with intermediate flexibility, or flexural modulus, are positioned between rigid components and flexible outer layers. This gradually reduces the flexural modulus of the flexible electronics device rather than have an interface between a rigid material and a flexible material. Various materials and methods of forming the layers are described. In addition, an encapsulate layer can be cured to varying flexural moduli to gradually reduce the flexural moduli from the rigid component to the flexible outer layers or bulk structure of the flexible electronic device.


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