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William L Uy

USPTO Granted Patents = 13 (Patent Applications = 2)

Average Co-Inventor Count = 3.8

ph-index = 2

Forward Citations = 9(Granted Patents)

Company Filing History:

Years Active: 2018-2025

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13 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12332131 - Industrial internet of things (IIOT) in-situ stress real-time monitoring system (2025-06-17),

2. 12156356 - Electronic encapsulation through stencil printing (2024-11-26),

3. 11493414 - Testing system for flexible sample in electronics having a retractable holder configured to conform a sample by a mandrel (2022-11-08),

4. 11470717 - Stress relief encapsulation for flexible hybrid electronics (2022-10-11),

5. 11289393 - Methods, devices, and systems for electronic device molding and encapsulation (2022-03-29),

6. 11064613 - Electronics encapsulation through hotmelt lamination (2021-07-13),

7. 10999926 - Stress relief encapsulation for flexible hybrid electronics (2021-05-04),

8. 10993635 - Integrating biosensor to compression shirt textile and interconnect method (2021-05-04),

9. 10687421 - Fabric with woven wire braid (2020-06-16),

10. 10653010 - Connection of multilayer printed conductive ink through filled microvias (2020-05-12),

11. 10575381 - Electroluminescent display on smart textile and interconnect methods (2020-02-25),

12. 10535845 - Flexible and stretchable chain battery (2020-01-14),

13. 9894820 - SMT DIMM connector auto safe remove nozzle (2018-02-13),

Title: Innovative Contributions of William L. Uy in the Field of Electronics

Introduction

William L. Uy is a prominent inventor based in San Jose, CA, known for his significant contributions to the technology sector, particularly in electronic devices and systems. With a remarkable portfolio of 13 patents, his work showcases innovative solutions that enhance the performance and reliability of electronic manufacturing processes.

Latest Patents

Among his notable inventions is the **Industrial Internet of Things (IIOT) In-Situ Stress Real-Time Monitoring System**. This system involves the integration of sensors within an In-Circuit Tester (ICT) that monitor stress exerted on Printed Circuit Boards (PCBs) during manufacturing. By employing IoT technology, this device records and displays real-time stress data, enabling technicians to address potential failures by analyzing historical information.

Another significant patent is the **Electronic Encapsulation Through Stencil Printing**, which focuses on the methods and systems used to effectively encapsulate electronic devices. This process includes positioning an electronic device within a mold cavity and utilizing screen or stencil printing to apply a liquid encapsulant around the device. This innovation ensures comprehensive coverage of electronic components, enhancing durability and performance.

Career Highlights

William L. Uy has made impactful contributions while working for esteemed companies such as Flex Ltd. and Flextronics Ap, LLC. His experience in these organizations has further enriched his expertise in the realm of electronics and manufacturing processes.

Collaborations

Throughout his career, Uy has collaborated with notable professionals, including Weifeng Liu and Dongkai Shangguan. Their teamwork has fostered an environment of innovation, driving advancements in technology and electronic device encapsulation solutions.

Conclusion

William L. Uy exemplifies the spirit of innovation in the technology sector, with his patented inventions contributing to the efficiency and effectiveness of electronic manufacturing. His ongoing commitment to improving industry standards solidifies his reputation as a leading inventor in the field.

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