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For the Inventor, By the Inventor

Penang, Malaysia

Cheng Siew Tay

This inventor holds 9 USPTO granted patents. Top assignees: Intel Corporation, Other. Active years: 2007-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cheng Siew Tay. Retrieved from https://idiyas.com/inventor/cheng-siew-tay

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 9

% Patents Active = 33.3

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 72(Granted Patents)


Location History:

  • Tanjung Bungah, MY (2007 - 2010)
  • 11200 Tanjung Bungah, Penang, MY (2010)
  • Penang, MY (2007 - 2013)

Company Filing History:

goldMedal8 out of 56,463 
 
Intel Corporation
 patents
silverMedal1 out of 834,708 
Other
 patents

Years Active: 2007-2013

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9 patents (USPTO):Explore Patents
1. 8533657 - Printed circuit boards having pads for solder balls and methods for the implementation thereof (2013-09-10),
2. 8079011 - Printed circuit boards having pads for solder balls and methods for the implementation thereof (2011-12-13),
3. 7789285 - Solder printing process to reduce void formation in a microvia (2010-09-07),
4. 7642660 - Method and apparatus for reducing electrical interconnection fatigue (2010-01-05),
5. 7400040 - Thermal interface apparatus, systems, and methods (2008-07-15),
6. 7331503 - Solder printing process to reduce void formation in a microvia (2008-02-19),
7. 7326859 - Printed circuit boards having pads for solder balls and methods for the implementation thereof (2008-02-05),
8. 7242084 - Apparatuses and associated methods for improved solder joint reliability (2007-07-10),
9. 7173342 - Method and apparatus for reducing electrical interconnection fatigue (2007-02-06),

Title: Cheng Siew Tay: Innovator in Printed Circuit Board Technology

Introduction

Cheng Siew Tay is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of printed circuit board technology, holding a total of 9 patents. His innovative designs and methods have advanced the reliability and performance of electronic devices.

Latest Patents

One of Cheng Siew Tay's latest patents focuses on printed circuit boards having pads for solder balls and methods for their implementation. This invention includes a group of pads designed to be soldered to a respective group of solder balls of a device. Each pad features a crack initiation point on its perimeter, strategically located where cracks in a solder ball are anticipated to start after soldering. For pads with a microvia, the center of the microvia is positioned farther from the crack initiation point than the center of the pad. Additionally, for pads with a trace merging along a portion of their perimeter, that portion avoids the vicinity of the crack initiation point.

Career Highlights

Cheng Siew Tay has worked with prominent companies, including Intel Corporation. His experience in the industry has allowed him to develop and refine his innovative ideas, contributing to advancements in electronic manufacturing.

Collaborations

Throughout his career, Cheng has collaborated with talented individuals such as Swee Kian Cheng and Pek Chew Tan. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Cheng Siew Tay's contributions to printed circuit board technology exemplify his dedication to innovation and excellence. His patents and collaborations reflect a commitment to enhancing the performance of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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