The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2008
Filed:
Jun. 10, 2003
Applicants:
Eng Hooi Yap, Penang, MY;
Cheng Siew Tay, Penang, MY;
Pek Chew Tan, Penang, MY;
Inventors:
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
An apparatus and system, as well as fabrication methods therefor, may include a substrate coupled to a first material and a second material. The first and second materials may comprise adjacent metals, and may have different coefficients of thermal expansion sufficient to reduce the amount of substrate warp that can occur due to heating and cooling.
Quick Actions:
Yap, Eng. (2008). Thermal interface apparatus, systems, and methods (U.S. Patent No. 7400040). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7400040
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile