The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2008
Filed:
Oct. 29, 2004
Applicants:
Cheng Siew Tay, Penang, MY;
Pek Chew Tan, Penang, MY;
Swee Kian Cheng, Kedah, MY;
Eng Hooi Yap, Penang, MY;
Inventors:
Cheng Siew Tay, Penang, MY;
Pek Chew Tan, Penang, MY;
Swee Kian Cheng, Kedah, MY;
Eng Hooi Yap, Penang, MY;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the second size is greater than the first size.
Quick Actions:
Tay, Cheng. (2008). Solder printing process to reduce void formation in a microvia (U.S. Patent No. 7331503). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7331503
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