Kedah, Malaysia

Swee Kian Cheng

This inventor holds 4 USPTO granted patents. Top assignees: Intel Corporation, Other. Active years: 2007-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Swee Kian Cheng. Retrieved from https://idiyas.com/inventor/swee-kian-cheng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 25.0

Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 67(Granted Patents)


Location History:

  • Kedah, MY (2007 - 2008)
  • Kulim, MY (2010)
  • 09000 Kulim, Kedah, MY (2010)

Company Filing History:


Years Active: 2007-2010

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4 patents (USPTO):Explore Patents

Title: Swee Kian Cheng: Innovator in Microelectronics

Introduction

Swee Kian Cheng is a notable inventor based in Kedah, Malaysia. He has made significant contributions to the field of microelectronics, holding a total of 4 patents. His innovative work focuses on improving soldering processes and enhancing the reliability of electrical interconnections in microelectronic packages.

Latest Patents

One of his latest patents is a solder printing process designed to reduce void formation in a microvia. This method involves filling a microvia formed in a bond pad with solder paste that contains solder balls of a smaller size, while simultaneously coating the bond pad with solder paste that includes larger solder balls. This innovative approach aims to enhance the quality and reliability of solder joints.

Another significant patent is a method and apparatus for reducing electrical interconnection fatigue. This invention addresses the challenges of crack initiation and propagation in electrical interconnections between components and substrates in ball grid array microelectronic packages. By utilizing a hybrid of dielectric defined and non-dielectric defined electrical interconnects, this method reduces the potential for electrical interconnection failure. Additionally, the selective orientation of the dielectric defined edge portion of the electrical interconnect helps resist crack propagation and component failure.

Career Highlights

Swee Kian Cheng has worked with prominent companies in the technology sector, including Intel Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas in microelectronics.

Collaborations

Throughout his career, Swee Kian Cheng has collaborated with talented individuals such as Cheng Siew Tay and Eng Huat Goh. These collaborations have contributed to the advancement of his research and inventions.

Conclusion

Swee Kian Cheng is a distinguished inventor whose work in microelectronics has led to valuable patents that enhance the reliability of soldering processes and electrical interconnections. His contributions continue to impact the field positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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