The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2007
Filed:
May. 27, 2005
Applicants:
Chee Wai Wong, Kuala Lumpur, MY;
Cheng Siew Tay, Tanjung Bungah, MY;
Inventors:
Chee Wai Wong, Kuala Lumpur, MY;
Cheng Siew Tay, Tanjung Bungah, MY;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
Apparatuses and associated methods to improve integrated circuit packaging are generally described. More specifically, apparatuses and associated methods to improve solder joint reliability are described. In this regard, according to one example embodiment, one or more strengthening pin(s) are coupled to the periphery of a package substrate, the strengthening pin(s) capable of coupling to a circuit board.