This inventor holds 11 USPTO granted patents and 2 published patent applications. Top assignee: Winbond Electronics Corporation. Active years: 2019-2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2019-2025
Title: Innovations of Cheng-Hong Wei
Introduction
Cheng-Hong Wei is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of memory devices, holding a total of 11 patents. His work focuses on advancing technology in memory storage solutions.
Latest Patents
One of his latest patents is a memory device and method of manufacturing the same. This invention includes a substrate, a plurality of stack structures, and a protective layer. The stack structures are arranged along a first direction on an array area of the substrate, with each structure extending along a second direction that differs from the first. In a cross-sectional view, each stack structure consists of a charge storage structure, a control gate, and a cap layer, with the cap layer featuring a multilayer structure. The protective layer covers the sidewalls of the stack structures, ensuring durability and efficiency. Another notable patent is a method for manufacturing resistive random access memory (RRAM). This RRAM includes a first dielectric layer formed on a substrate, along with two memory cells that feature bottom electrode structures separated by trenches. The design ensures that the top surfaces of various components are coplanar, enhancing the device's performance.
Career Highlights
Cheng-Hong Wei is currently employed at Winbond Electronics Corporation, where he continues to innovate in the field of memory technology. His work has been instrumental in developing advanced memory solutions that meet the growing demands of modern electronics.
Collaborations
Cheng-Hong Wei has collaborated with notable coworkers, including Hung-Sheng Chen and Chien-Hsiang Yu. Their combined expertise has contributed to the success of various projects and patents.
Conclusion
Cheng-Hong Wei's contributions to memory technology through his patents and work at Winbond Electronics Corporation highlight his role as a leading inventor in the field. His innovations continue to shape the future of memory devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile