Cheng-Hong Wei

This inventor holds 11 USPTO granted patents and 2 published patent applications. Top assignee: Winbond Electronics Corporation. Active years: 2019-2025.

USPTO Granted Patents = 11 (Patent Applications = 2)

% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 1

Forward Citations = 4(Granted Patents)

Company Filing History:

11 out of 2,106

Winbond Electronics Corporation

patents

Years Active: 2019-2025

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11 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12336175 - Memory device and method of manufacturing the same (2025-06-17),

2. 12193344 - Method for manufacturing resistive random access memory (2025-01-07),

3. 12027422 - Semiconductor structures and methods for forming the same (2024-07-02),

4. 11978768 - Manufacturing method of semiconductor structure (2024-05-07),

5. 11778932 - Resistive random access memory and manufacturing method thereof (2023-10-03),

6. 11764274 - Memory device having contact plugs with narrower and wider portions (2023-09-19),

7. 11721720 - Semiconductor structure (2023-08-08),

8. 11056564 - Method of manufacturing a memory device (2021-07-06),

9. 10957594 - Manufacturing method of semiconductor chip (2021-03-23),

10. 10685883 - Method of wafer dicing and die (2020-06-16),

11. 10515853 - Method of wafer dicing (2019-12-24),

Profile summary based on public USPTO records.

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2 patents pending:

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