The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2023

Filed:

Mar. 21, 2021
Applicant:

Winbond Electronics Corp., Taichung, TW;

Inventors:

Tseng-Yao Pan, Taichung, TW;

Chien-Hsiang Yu, Taichung, TW;

Ching-Yung Wang, Taichung, TW;

Cheng-Hong Wei, Taichung, TW;

Ming-Tsang Wang, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0657 (2013.01); H01L 21/3086 (2013.01);
Abstract

A semiconductor structure includes a trunk portion and a branch portion. The trunk portion extends in a first direction. The branch portion is connected to the trunk portion. The branch portion includes a handle portion and a two-pronged portion. The handle portion is connected to the trunk portion and extends in a second direction. The second direction intersects the first direction. The two-pronged portion is connected to the handle portion. A line width of the handle portion is greater than a line width of the two-pronged portion.


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