Location History:
- Hsin-chu, CN (2005)
- Hsin-Chu, TW (2002 - 2008)
- Kaohsiung, TW (2007 - 2014)
Company Filing History:
Years Active: 2002-2014
Title: Innovations in Semiconductor Packaging: The Contributions of Chender Huang
Introduction
Chender Huang is a prominent inventor based in Hsin-Chu, Taiwan, known for his substantial contributions to the semiconductor industry. With 22 patents to his name, he has played a pivotal role in advancing packaging technologies crucial for electronic devices. His recent work focuses on innovative fabrication methods that enhance the efficiency and performance of semiconductor packaging.
Latest Patents
Among Chender Huang's most recent patents are two significant innovations: a fabrication method of package structures with simplified encapsulation and wiring. These patents detail a unique structure comprising a substrate with a terminal and a chip that lies over it. The structure's innovative design includes a patterned cover plate that exposes an electrode while allowing for a conductive material to connect the electrode with the terminal. The encapsulant then covers the terminal, conductive material, and electrode, while exposing the cover plate over the chip's center region. This design aims to streamline the manufacturing process and improve the performance of semiconductor devices.
Career Highlights
Chender Huang is an integral member of Taiwan Semiconductor Manufacturing Company Limited, a leading player in the global semiconductor industry. His work has significantly impacted the development of packaging technologies essential for various electronic applications. The innovative methods he has developed help to ensure that electronic components can operate efficiently and effectively within their allocated space.
Collaborations
Collaboration is essential in innovation, and Chender Huang works alongside distinguished colleagues like Pei-Haw Tsao and Ken Hui Chen. Together, they contribute to pioneering advancements in semiconductor packaging, reflecting the importance of teamwork in driving innovation forward.
Conclusion
Chender Huang's dedication to innovation and excellence in semiconductor packaging has made him a key figure in the industry. His numerous patents not only highlight his inventive spirit but also underline the potential for continued advancements in technology. As the semiconductor landscape evolves, the contributions of inventors like Chender Huang will play a crucial role in shaping the future of electronics.