The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2008
Filed:
Feb. 17, 2005
Applicants:
Ken Chen, Hsinchu, TW;
Chender Huang, Hsin-Chu, TW;
Pei-haw Tsao, Taichung, TW;
Jones Wang, Jung-he, TW;
Hank Huang, Kaohsiung, TW;
Inventors:
Ken Chen, Hsinchu, TW;
Chender Huang, Hsin-Chu, TW;
Pei-Haw Tsao, Taichung, TW;
Jones Wang, Jung-he, TW;
Hank Huang, Kaohsiung, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A new method is provided for the interface between a stress relieve interface layer of polyimide and a thereover created layer of mold compound. The invention provides for creating a pattern in the stress relieve layer of polyimide before the layer of mold compound is formed over the stress relieve layer of polyimide.