Location History:
- Taipei, TW (2003 - 2005)
- Jung he, CN (2005)
- Jung he, TW (2003 - 2008)
Company Filing History:
Years Active: 2003-2008
Title: Innovations of Jones Wang
Introduction
Jones Wang is a prominent inventor based in Jung-He, Taiwan. He has made significant contributions to the field of microelectronics, holding a total of 8 patents. His work focuses on enhancing the performance and reliability of electronic components.
Latest Patents
One of his latest patents is titled "Enhanced adhesion strength between mold resin and polyimide." This invention provides a new method for improving the interface between a stress relieve interface layer of polyimide and a layer of mold compound. The method involves creating a pattern in the stress relieve layer of polyimide before the mold compound is applied. Another notable patent is "Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly." This method outlines a comprehensive process for assembling microelectronic components, ensuring the effective alignment and bonding of flip chips to substrates.
Career Highlights
Jones Wang is currently employed at Taiwan Semiconductor Manufacturing Company Ltd., where he continues to innovate and develop new technologies. His expertise in microelectronics has positioned him as a key player in the industry.
Collaborations
Throughout his career, Jones has collaborated with notable colleagues such as Pei-Haw Tsao and Chender Huang. Their combined efforts have led to advancements in microelectronic assembly techniques.
Conclusion
Jones Wang's contributions to the field of microelectronics through his patents and collaborative efforts highlight his role as an influential inventor. His work continues to shape the future of electronic manufacturing and assembly.