The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2003
Filed:
Sep. 20, 2002
Applicant:
Inventors:
Pei-Haw Tsao, Taichung, TW;
Chender Huang, Hsin-chu, TW;
Jones Wang, Jung he, TW;
Ken Chen, Hsinchu, TW;
Hank Huang, Jungli, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/130 ; H01L 2/146 ;
U.S. Cl.
CPC ...
H01L 2/130 ; H01L 2/146 ;
Abstract
A method of protecting the active surface, front side, of semiconductor wafers during the operations of backside grinding, transporting, and packaging has been achieved. The invention discloses a method for applying an organic passivation layer or an aqueous material for protection of the active components. These materials are easily removed prior to final packaging of the dies.