The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2006
Filed:
Sep. 05, 2001
Pei-haw Tsao, Taichung, TW;
Chender Huang, Hsin-Chu, TW;
Jones Wang, Jung-He, TW;
Ken Chen, Hsinchu, TW;
Pei-Haw Tsao, Taichung, TW;
Chender Huang, Hsin-Chu, TW;
Jones Wang, Jung-He, TW;
Ken Chen, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin Chu, TW;
Abstract
A method of making a microelectronic assembly buying restraining a substrate in a fixture at room temperature, placing a flip chip on the substrate so that conductive bumps on the flip chip are aligned with contact pads on the substrate, heating the flip chip, the substrate and the fixture to reflow the conductive bumps on the flip chip, cooling the flip chip, substrate and fixture to solidify the conductive bumps and to mount the flip chip to the substrate, depositing an underfill between the flip chip and the substrate, curing the underfill by heating the flip chip, substrate, underfill and fixture to an elevated temperature, and removing the flip chip mounted substrate from the fixture.