Introduction: Chen Cheng Chou, a prominent inventor based in Shanhua, Taiwan, holds a remarkable portfolio of 12 patents that have significantly advanced the field of semiconductor technology. His inventions showcase a deep understanding of the intricacies involved in fabricating cutting-edge electronic components, particularly in the development of FinFET structures and three-dimensional (3D) stacked chip architectures.

Latest Patents: Chen's latest patents include innovative techniques that enhance the manufacturing processes of semiconductors. One notable invention is titled "Tilt implantation for STI formation in FinFET structures." This patent details a method for fabricating FinFETs by employing a tilt angle for dopant implantation, which results in a modification of the isolation region's surface profile. The process involves carefully orchestrated etching to achieve desired step heights, allowing for improved efficiency in transistor performance.

Another of his recent patents focuses on an "On-chip heat spreader." This invention describes a 3D stacked chip structure designed to efficiently dissipate heat generated during operation. By integrating a heat spreader within the dielectric layer of the first die, heat can be effectively diffused throughout the stacked chip, addressing thermal management challenges inherent in high-performance electronics.

Career Highlights: Throughout his career, Chen Cheng Chou has been a vital contributor to Taiwan Semiconductor Manufacturing Company Limited (TSMC), where he has utilized his expertise to push the boundaries of semiconductor manufacturing. His work not only enhances the performance of individual components but also contributes to the overall advancement and competitiveness of TSMC in the global market.

Collaborations: Chen has collaborated with notable coworkers such as Chuan-Yi Lin and Ching-Chen Hao. Together, they have fostered an innovative environment, combining their talents to enhance project outcomes and stimulate creative problem-solving within their field.

Conclusion: In conclusion, Chen Cheng Chou's contributions to semiconductor technology are evident through his extensive patent portfolio and collaborative efforts. His pioneering inventions in FinFET structures and 3D chip designs demonstrate his commitment to innovation and excellence within the industry. As he continues to work at TSMC, his future endeavors are sure to impact the next generation of electronic components, further solidifying his status as a leading inventor in the field.

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