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For the Inventor, By the Inventor

Mountain View, CA, United States of America

Cheang-Whang Chang

This inventor holds 17 USPTO granted patents and 1 published patent application and 1 EPO patent, primarily in Semiconductor Packaging. Top assignee: Xilinx, Inc.. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cheang-Whang Chang. Retrieved from https://idiyas.com/inventor/cheang-whang-chang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17 

% Patents Active = 94.1

 

Average Co-Inventor Count = 4.6

ph-index = 5

Forward Citations = 147(Granted Patents)


Company Filing History:

goldMedal17 out of 5,112 
 
Xilinx, Inc.
 patents

Years Active: 2014-2026

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Areas of Expertise:
Integrated Circuit
Electromagnetic Radiation
Thermal Management
Silicon Package
Die Testing
Memory Devices
Transistor Characterization
Bond Connections
Manufacturing
Resistors
Modular Core Dice
Process Variations
17 patents (USPTO):Explore Patents
1. 12557660 - Integrated circuit (IC) protections comprising electromagnetic radiation blocking material (2026-02-17),
2. 11585854 - Runtime measurement of process variations and supply voltage characteristics (2023-02-21),
3. 11488936 - Stacked silicon package assembly having vertical thermal management (2022-11-01),
4. 11355412 - Stacked silicon package assembly having thermal management (2022-06-07),
5. 11145566 - Stacked silicon package assembly having thermal management (2021-10-12),
6. 11114344 - IC die with dummy structures (2021-09-07),
7. 11054461 - Test circuits for testing a die stack (2021-07-06),
8. 10770430 - Package integration for memory devices (2020-09-08),
9. 10692837 - Chip package assembly with modular core dice (2020-06-23),
10. 10431565 - Wafer edge partial die engineered for stacked die yield (2019-10-01),
11. 10379155 - In-die transistor characterization in an IC (2019-08-13),
12. 10262911 - Circuit for and method of testing bond connections between a first die and a second die (2019-04-16),
13. 10103139 - Method and design of low sheet resistance MEOL resistors (2018-10-16),
14. 10096502 - Method and apparatus for assembling and testing a multi-integrated circuit package (2018-10-09),
15. 9412674 - Shielded wire arrangement for die testing (2016-08-09),

Title: Inspiring Innovator: Cheang-Whang Chang

Introduction:

Cheang-Whang Chang, a distinguished inventor based in Mountain View, CA, USA, is renowned for his passion for innovation and his unwavering commitment to excellence. With a total of 16 patents to his name, Chang's contributions have significantly impacted the field of technology and continue to inspire the next generation of inventors and technologists worldwide.

Latest Patents:

Among his latest patents is the groundbreaking "Runtime Measurement of Process Variations and Supply Voltage Characteristics" – a innovative method that involves an integrated circuit (IC) device, application-specific sub-circuits, and a measuring circuit. This patent showcases Chang's expertise in circuit design and time measurement techniques.

Another notable patent is the "Stacked Silicon Package Assembly Having Vertical Thermal Management", which emphasizes improved thermal management through electrically floating extra-die heat transfer posts. This patent demonstrates Chang's innovative approach to addressing critical challenges in the semiconductor industry.

Career Highlights:

Currently affiliated with Xilinx, Inc., a leading technology company, Chang has played a pivotal role in driving innovation and advancing semiconductor technologies. His exceptional skills and dedication have earned him a reputation as a visionary inventor within the industry.

Collaborations:

Throughout his career, Chang has collaborated with esteemed colleagues such as Henley Liu and Myongseob Kim. Together, they have worked on cutting-edge projects and pushed the boundaries of technological advancements.

Conclusion:

In conclusion, Cheang-Whang Chang's remarkable journey as an inventor reflects his unparalleled dedication to pushing the boundaries of innovation. His pioneering spirit continues to inspire countless individuals in the field of technology, shaping the future of inventions and paving the way for new possibilities.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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