The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2016

Filed:

Oct. 24, 2013
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventors:

Myongseob Kim, Pleasanton, CA (US);

Henley Liu, San Jose, CA (US);

Cheang-Whang Chang, Mountain View, CA (US);

Sanjiv Stokes, Los Altos, CA (US);

Assignee:

XILINX, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 29/10 (2006.01); H01L 21/66 (2006.01); G01R 31/26 (2014.01);
U.S. Cl.
CPC ...
H01L 22/34 (2013.01); H01L 22/14 (2013.01);
Abstract

An integrated circuit includes a die having a conductive layer. The conductive layer includes a data wire, a first power supply wire of a first voltage potential, and a second power supply wire of a second voltage potential different from the first voltage potential. A segment of the data wire is located between, and substantially parallel to, a segment of the first power supply wire and a segment of the second power supply wire. Further, the first power supply wire is coupled to a first probe structure; and, the second power supply wire is coupled to a second probe structure.


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