Hsinchu, Taiwan

Chao-Wei Li

Average Co-Inventor Count = 4.4

ph-index = 2

Forward Citations = 11(Granted Patents)

Forward Citations (Not Self Cited) = 10(Sep 21, 2024)

Location History:

  • Taipei, TW (2011 - 2014)
  • Hsinchu, TW (2013 - 2023)


Years Active: 2011-2025

where 'Filed Patents' based on already Granted Patents

19 patents (USPTO):

Title: Innovator Spotlight: Chao-Wei Li

Introduction

Chao-Wei Li, an accomplished inventor based in Hsinchu, Taiwan, has made significant contributions to the field of semiconductor packaging technology. With a remarkable total of 19 patents to his name, his work continues to pave the way for advancements in electronic efficiency and integration.

Latest Patents

Among his recent innovations, Chao-Wei Li's patents include a unique package structure incorporating a thermoelectric cooler. This inventive package structure features a first redistribution layer (RDL) that houses a die and a circuit substrate, enhancing thermal management in electronic devices. The design seamlessly integrates a thermoelectric cooler containing both N-type and P-type doped regions, reflecting his commitment to optimizing electronic performance.

Another notable patent from Li is the development of a package structure and its manufacturing method. This involves a substrate with two different semiconductor elements electrically connected, encapsulated within a molding layer designed for improved functionality and efficiency. This inventive approach not only protects the semiconductor components but also specifies distinct functions for each element, showcasing Li's innovative nature.

Career Highlights

Chao-Wei Li has built a distinguished career through his roles in leading organizations, including the Industrial Technology Research Institute and Taiwan Semiconductor Manufacturing Company Ltd. His tenure at these institutions has provided him with a platform to develop and patent groundbreaking technologies that address current challenges in the electronics industry.

Collaborations

Throughout his career, Chao-Wei Li has collaborated with several proficient colleagues, including Hung-Lieh Hu and Chen-Peng Hsu. These partnerships highlight the importance of teamwork in fostering innovation and achieving technological breakthroughs in the competitive sector of semiconductor manufacturing.

Conclusion

Chao-Wei Li's impressive portfolio of patents reinforces his position as a notable inventor in the realm of semiconductor technology. His work not only reflects individual brilliance but also underscores the power of collaboration in driving forward the frontiers of innovation. As he continues to develop new solutions, the impact of his inventions is sure to resonate within the industry for years to come.

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