Industrial Technology Research Institute

Taiwan Semiconductor Manufacturing Comp. Ltd.

Au Optronics Corporation

Karl Storz Gmbh & Co Kg

Chao-Wei Li

Hung-Lieh Hu

Chen-Peng Hsu

Ching-Hua Hsieh

Yao-Jun Tsai

Chih-Wei Lin

Sheng-Feng Weng

Sheng-Hsiang Chiu

Chia-Min Lin

Yu-Hao Chen

Chun-Hsing Lee

Syuan-Ling Yang

Yi-Da Tsai

Ya-Hui Chiang

Cheng-Da Shaw

Chao-Wei Chiu

Hsueh-Chih Chang

Wei-Lun Tsai

Kai-Ming Chiang

Hsiu-Jen Lin

Guan-Yu Chen

Kai-Fung Chang

Chun-Chuan Lin

Rong Xuan

Chen-Kun Chen

Ju-Chin Chen

Chih-Hao Hsu

Hsin-Hsiang Lo

Wei-Ming Cheng

Hsin-Yun Tsai

Tzu-Ting Chou

Ji-Feng Chen

Yi-Ling Lin

Ming-Yu Yen

Wei-Jhan Tsai

Chien-Peng Hsu

Provided is a package structure including a first redistribution layer (RDL) structure, a die, a circuit substrate, and a first thermoelectric cooler. The RDL) structure has a first side and a second side opposite to each other. The die is disposed on the first side of the first RDL structure. The circuit substrate is bonded to the second side of the first RDL structure through a plurality of first conductive connectors. The first thermoelectric cooler is between the first RDL structure and the circuit substrate, wherein the first thermoelectric cooler includes at least a N-type doped region and at least a P-type doped region.

Package structure having thermoelectric cooler

A package structure including a semiconductor die, an encapsulant, a redistribution structure, and a through insulating via is provided. The first redistribution structure includes an insulating layer and a circuit layer. The semiconductor die is disposed on the first redistribution structure. The semiconductor die includes a semiconductor base, through semiconductor vias, a dielectric layer, and bonding connectors. Through semiconductor vias penetrate through the semiconductor base. The dielectric layer is disposed on a backside of the semiconductor base. The dielectric layer of the semiconductor die is bonded with the insulating layer of the first redistribution structure. The bonding connectors are embedded in the dielectric layer and connected to the through semiconductor vias. The bonding connectors of the semiconductor die are bonded with bonding pads of the circuit layer. The encapsulant is disposed on the first redistribution structure and encapsulates the semiconductor die.

Package structure and manufacturing method thereof

A package structure including a substrate, a first semiconductor element disposed on and electrically connected with the substrate, a second semiconductor element disposed on and electrically connected with the substrate and a molding layer disposed over the substrate and covering at least a top surface of the substrate. The second semiconductor element and the first semiconductor element perform different functions. The molding layer encapsulates the second semiconductor element and wraps around sidewalls of the first semiconductor element. A top surface of the molding layer is higher than a top surface of the first semiconductor element. The molding layer has an opening extending from the top surface of the molding layer to the top surface of the first semiconductor element, so that the top surface of the first semiconductor element is exposed.

A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Package structure

Memory device, package structure and fabricating method thereof

The present invention provides a polarizer module and an operation method thereof. The polarizer module includes a bifacial reflective polarizer, a first liquid crystal layer, a second liquid crystal layer, a first polarizer, and a second polarizer. The bifacial reflective polarizer has a first surface and a second surface opposite to each other. The first liquid crystal layer and the second liquid crystal layer are disposed on the first surface and the second surface respectively. The first polarizer and the second polarizer are disposed on the first liquid crystal layer and the second liquid crystal layer respectively.

Polarizer module and operation method thereof

Provided is a display apparatus including a first cholesteric liquid crystal panel, a second cholesteric liquid crystal panel, and a third cholesteric liquid crystal panel. The first cholesteric liquid crystal panel has a light receiving surface. The second cholesteric liquid crystal panel overlaps the first cholesteric liquid crystal panel and is disposed on a side of the first cholesteric liquid crystal panel away from the light receiving surface. The third cholesteric liquid crystal panel overlaps the second cholesteric liquid crystal panel and is disposed on a side of the second cholesteric liquid crystal panel away from the first cholesteric liquid crystal panel. One of the first cholesteric liquid crystal panel, the second cholesteric liquid crystal panel, and the third cholesteric liquid crystal panel is provided with multiple first light shielding patterns separated from each other.

Display apparatus

A display module includes a display panel and an electronically controlled shutter including polarizers, conductive layers, supporting members, and a display medium layer. Each pixel of the display panel has a first edge and a second edge. A shape unit composed of any four supporting members adjacent to one another has a third edge and a fourth edge. An angle between the third edge and the first edge is larger than or equal to 0 degrees. An angle between the fourth edge and the second edge is larger than 0 degrees. Lengths of the first, second, third, and fourth edges are respectively X, Y, X', and Y&#x2032;. Any four supporting members adjacent to one another satisfy at least one of Condition 1: X&#x2032;&#x3e;X and X&#x2032;&#x2260;nX; and Condition 2: Y&#x2032;&#x3e;Y and Y&#x2032;&#x2260;nY, wherein n is a positive integer.

Display module

A light source module optically coupled to an optical fiber which has a light incident surface is provided. The light source module includes a plurality of light sources and a concentrator. The light sources surround an axis, and the axis passes through a center of the light incident surface and is perpendicular to the light incident surface. Each of the light sources is capable of emitting a beam along a transmitting path toward the axis. The concentrator is disposed at the axis and includes a curvy reflective surface located on the transmitting paths for reflecting the beams to the light incident surface of the optical fiber.

Light source module

A semiconductor light source device is provided. The semiconductor light source device includes a light guide, at least one semiconductor light source set and at least one light transformation coupler. The light transformation coupler is disposed between the semiconductor light source set and the light guide for guiding the light emitted from the semiconductor light source set to the light guide. The light transformation coupler has an inclined surface and a curved surface. The inclined surface is a multi-level inclined surface with several slopes.

Semiconductor light source device

An illumination device including a base, a heat dissipation member, at least one flexible printed circuit board (FPC), and a plurality of light-emitting elements is provided. The heat dissipation member disposed on the base has a central axis, a plurality of holding curvy surfaces and a plurality of heat dissipation channels extending along the central axis, wherein the holding curvy surfaces and the heat dissipation channels are staggered and arranged about the central axis, and each of the holding curvy surfaces radially extends along the central axis. The flexible printed circuit board is disposed on the holding curvy surfaces. The light-emitting elements are disposed on the flexible printed circuit board. An assembling method of the illumination device is also provided.

Illumination device and assembling method thereof

A modularized illuminating device includes a retaining base, a lighting module, and a light guide element. The retaining base includes an elastic positioning unit. The lighting module is removably disposed on the retaining base, and has a sliding groove and a retaining groove. The light guide element is disposed on the retaining base and faces to the lighting module. When the lighting module is installed to the retaining base along a plugging direction, the elastic positioning unit slides from the sliding groove to the retaining groove to retain the lighting module in the retaining base.

Detachable LED module

A light emitting chip package module includes a substrate, a light emitting chip package structure, and a magnetic device. The substrate has a surface. The light emitting chip package structure is disposed on the surface of the substrate. The light emitting chip package structure includes a carrier, a light emitting chip, and a sealant. The light emitting chip is disposed on and electrically connected to the carrier. The sealant is disposed on the carrier and covers the light emitting chip. The magnetic device is disposed next to the light emitting chip package structure to apply a magnetic field to the light emitting chip.

Light emitting chip package module and light emitting chip package structure and manufacturing method thereof

A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The thermal-conductive transparent liquid fills up the sealed space.

Light emitting diode package structure

Light emitting diode lamp

Growing community of inventors

Hsinchu, Taiwan

Chao-Wei Li