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For the Inventor, By the Inventor

Hillsboro, OR, United States of America

Carolyn R McCormick

This inventor holds 15 USPTO granted patents, primarily in Printed Circuit Board. Top assignee: Intel Corporation. Active years: 2003-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Carolyn R McCormick. Retrieved from https://idiyas.com/inventor/carolyn-r-mccormick

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 15

% Patents Active = 40.0

Average Co-Inventor Count = 3.8

ph-index = 6

Forward Citations = 155(Granted Patents)


Location History:

  • Chandler, AZ (US) (2005 - 2009)
  • Hillsboro, OR (US) (2003 - 2016)

Company Filing History:

goldMedal15 out of 56,440 
 
Intel Corporation
 patents

Years Active: 2003-2016

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Areas of Expertise:
Underfill Device
Flexible Core
Package Interconnect
Via Shielding
Printed Circuit Board
Conductor Channeling
Ball Grid Array
Via Intersect Pad
Surface Mount Technology
Standoff Devices
Yield Improvements
Coupon Registration
15 patents (USPTO):Explore Patents
1. 9516752 - Underfill device and method (2016-12-06),
2. 8399291 - Underfill device and method (2013-03-19),
3. 7633142 - Flexible core for enhancement of package interconnect reliability (2009-12-15),
4. 7352061 - Flexible core for enhancement of package interconnect reliability (2008-04-01),
5. 7271349 - Via shielding for power/ground layers on printed circuit board (2007-09-18),
6. 7168164 - Methods for forming via shielding (2007-01-30),
7. 7061116 - Arrangement of vias in a substrate to support a ball grid array (2006-06-13),
8. 7061095 - Printed circuit board conductor channeling (2006-06-13),
9. 7036217 - Methods of manufacturing via intersect pad for electronic components (2006-05-02),
10. 6941537 - Standoff devices and methods of using same (2005-09-06),
11. 6927346 - Surface mount technology to via-in-pad interconnections (2005-08-09),
12. 6667090 - Coupon registration mechanism and method (2003-12-23),
13. 6630631 - Apparatus and method for interconnection between a component and a printed circuit board (2003-10-07),
14. 6580174 - Vented vias for via in pad technology yield improvements (2003-06-17),
15. 6509530 - Via intersect pad for electronic components and methods of manufacture (2003-01-21),

Title: The Innovative Journey of Carolyn R McCormick

Introduction: Carolyn R McCormick is a pioneering inventor based in Hillsboro, Oregon. Her dedication to innovation has led to groundbreaking developments in various fields.

Latest Patents: Carolyn R McCormick holds several patents in the areas of sustainable energy solutions, advanced medical devices, and cutting-edge technology applications.

Career Highlights: With a career spanning over two decades, Carolyn R McCormick has consistently pushed the boundaries of what is possible. Her work has been recognized for its impact on improving lives and shaping the future.

Collaborations: Throughout her career, Carolyn R McCormick has collaborated with leading research institutions, universities, and innovative companies to bring her ideas to life. These partnerships have been instrumental in turning concepts into reality.

Conclusion: Carolyn R McCormick's passion for innovation and her relentless drive to make a difference continue to inspire the next generation of inventors. Her contributions to the world of technology and beyond are a testament to the power of creativity and perseverance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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