The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2006
Filed:
Sep. 26, 2001
Carolyn Mccormick, Hillsboro, OR (US);
Rebecca Jessep, Dallas, OR (US);
John Dungan, Hillsboro, OR (US);
David W. Boggs, Hillsboro, OR (US);
Daryl Sato, Beaverton, OR (US);
Carolyn McCormick, Hillsboro, OR (US);
Rebecca Jessep, Dallas, OR (US);
John Dungan, Hillsboro, OR (US);
David W. Boggs, Hillsboro, OR (US);
Daryl Sato, Beaverton, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An arrangement of pads with selective via in pad for mounting a semiconductor package on a substrate. In order to strengthen the soldered bonds, standard pads, which have a stronger bond, are used in locations of greatest stress and deflection. Vias in pad (VIP) are used at all other locations to improve routing advantages due to their smaller surface area.