John H Dungan

Title: John H Dungan: Innovator in Electronic Packaging

Introduction

John H Dungan is a notable inventor based in Hillsboro, OR (US), recognized for his contributions to electronic packaging and integrated circuit technology. With a total of 12 patents to his name, Dungan has made significant advancements in the field, particularly while working at Intel Corporation.

Latest Patents

Dungan's latest patents include an "Apparatus for providing an integrated printed circuit board registration coupon." This device features a plane metallization layer and a plane plated through hole, which is electrically isolated from a plurality of component mounting pads. The testing method for this device involves checking for current flow between the signal carrying through hole and the plane through hole, determining the device's functionality based on the presence or absence of current flow.

Another significant patent is for "Electronic packaging using conductive interposer connector." This patent describes the formation of a plurality of conductive connectors within an integrated circuit package, utilizing a conductive elastomer material and an interposer that links multiple conductive connectors together.

Career Highlights

Throughout his career, Dungan has focused on enhancing electronic packaging technologies, contributing to the efficiency and reliability of integrated circuits. His work at Intel Corporation has positioned him as a key player in the development of innovative electronic solutions.

Collaborations

Dungan has collaborated with notable colleagues, including David W Boggs and Daryl A Sato, further enriching his work and expanding the impact of his inventions.

Conclusion

John H Dungan's innovative spirit and dedication to advancing electronic packaging technology have led to significant contributions in the field. His patents reflect a commitment to improving the functionality and reliability of electronic devices.