The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2006
Filed:
Nov. 13, 2002
Applicants:
Daryl Sato, Beaverton, OR (US);
Gary Paek, Banks, OR (US);
John Dungan, Hillsboro, OR (US);
David W. Boggs, Hillsboro, OR (US);
Inventors:
Daryl Sato, Beaverton, OR (US);
Gary Paek, Banks, OR (US);
John Dungan, Hillsboro, OR (US);
David W. Boggs, Hillsboro, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for providing an improved solder joint for a via-in-pad ball grid array package. One or more bonding pads are formed upon a substrate. One or more vias are formed through the substrate within the bonding pad. The vias are plugged with a via plug material. The via plug material is then preconditioned such that an amount of volatiles within the via plug material is reduced.