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For the Inventor, By the Inventor

Hillsboro, OR, United States of America

David W Boggs

USPTO Granted Patents = 14

Average Co-Inventor Count = 3.6

ph-index = 7

Forward Citations = 355(Granted Patents)


Company Filing History:

goldMedal13 out of 54,750 
 
Intel Corporation
 patents
silverMedal1 out of 2,729 
 
Tektronix, Inc.
 patents

Years Active: 1990-2009

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14 patents (USPTO):Explore Patents
1. 7583513 - Apparatus for providing an integrated printed circuit board registration coupon (2009-09-01),
2. 7385288 - Electronic packaging using conductive interproser connector (2008-06-10),
3. 7325303 - Three-dimensional flexible interposer (2008-02-05),
4. 7241680 - Electronic packaging using conductive interposer connector (2007-07-10),
5. 7201583 - Three-dimensional flexible interposer (2007-04-10),
6. 7147141 - Preconditioning via plug material for a via-in-pad ball grid array package (2006-12-12),
7. 7084354 - PCB method and apparatus for producing landless interconnects (2006-08-01),
8. 7061116 - Arrangement of vias in a substrate to support a ball grid array (2006-06-13),
9. 7061095 - Printed circuit board conductor channeling (2006-06-13),
10. 6941537 - Standoff devices and methods of using same (2005-09-06),
11. 6787443 - PCB design and method for providing vented blind vias (2004-09-07),
12. 6667090 - Coupon registration mechanism and method (2003-12-23),
13. 6580174 - Vented vias for via in pad technology yield improvements (2003-06-17),
14. 4935584 - Method of fabricating a printed circuit board and the PCB produced (1990-06-19),

Title: The Innovative Contributions of David W. Boggs

Introduction

David W. Boggs, an inventive mind based in Hillsboro, Oregon, holds an impressive portfolio of 14 patents. His work primarily revolves around advancements in electronic packaging and circuit board technology. Throughout his career, Boggs has made significant contributions that enhance the efficiency and effectiveness of electronic devices.

Latest Patents

Among his notable inventions, Boggs has developed an "Apparatus for providing an integrated printed circuit board registration coupon." This device features a plane metallization layer and a plane plated through hole that is connected to the metallization layer. The device includes a method of testing where current flow between the signal carrying through hole and the plane through hole determines the functionality of the device. If current flows, the device fails; if not, it passes.

Another significant patent is related to "Electronic packaging using conductive interposer connector," which describes a method for forming a variety of conductive connectors within an integrated circuit package. These connectors are composed of conductive elastomer material, designed to enhance connectivity and performance in electronic systems.

Career Highlights

David W. Boggs has collaborated with prominent companies in the tech industry, notably Intel Corporation and Tektronix, Inc. His work at these institutions has enabled him to develop state-of-the-art technologies that revolutionize electronic packaging and assembly.

Collaborations

Throughout his career, Boggs has worked alongside esteemed colleagues, including Daryl A. Sato and John H. Dungan. These collaborations have played a crucial role in fostering innovative ideas and driving advancements in the field of electronics.

Conclusion

David W. Boggs’ contributions to the field of electronics through his patents have solidified his reputation as a leading inventor. His innovative work continues to impact the tech industry, paving the way for future advancements in electronic packaging and circuit design.

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