The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2013
Filed:
Jun. 29, 2005
Patricia a Brusso, Chandler, AZ (US);
Mitul B Modi, Phoenix, AZ (US);
Carolyn R. Mccormick, Hillsboro, OR (US);
Ruben Cadena, Tempe, AZ (US);
Sankara J Subramanian, Chandler, AZ (US);
Edward L. Martin, Chandler, AZ (US);
Patricia A Brusso, Chandler, AZ (US);
Mitul B Modi, Phoenix, AZ (US);
Carolyn R. McCormick, Hillsboro, OR (US);
Ruben Cadena, Tempe, AZ (US);
Sankara J Subramanian, Chandler, AZ (US);
Edward L. Martin, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An underfill device and method have been are provided. Advantages of devices and methods shown include dissipation of stresses at an interface between components such as a chip package and an adjacent circuit board. Another advantage includes faster manufacturing time and ease of manufacture using underfill devices and methods shown. An underfill assembly can be pre made with conductive structures included within the underfill assembly. Steps such as flowing epoxy and curing can be eliminated or performed concurrently with other manufacturing steps.