Brian W Messenger

USPTO Granted Patents = 16 (Patent Applications = 1)

Average Co-Inventor Count = 3.7

ph-index = 4

Forward Citations = 124(Granted Patents)

Company Filing History:

15 out of 164,108

International Business Machines Corporation

Years Active: 2004-2016

where 'Filed Patents' based on already Granted Patents

16 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 9293382 - Voltage contrast inspection of deep trench isolation (2016-03-22),

2. 8927989 - Voltage contrast inspection of deep trench isolation (2015-01-06),

3. 8836003 - Lateral epitaxial grown SOI in deep trench structures and methods of manufacture (2014-09-16),

4. 8723243 - Polysilicon/metal contact resistance in deep trench (2014-05-13),

5. 8692307 - Lateral epitaxial grown SOI in deep trench structures and methods of manufacture (2014-04-08),

6. 8642423 - Polysilicon/metal contact resistance in deep trench (2014-02-04),

7. 8445362 - Apparatus and method for programming an electronically programmable semiconductor fuse (2013-05-21),

8. 8232163 - Lateral epitaxial grown SOI in deep trench structures and methods of manufacture (2012-07-31),

9. 8106485 - Chemical oxide removal of plasma damaged SiCOH low k dielectrics (2012-01-31),

10. 7757200 - Structure of an apparatus for programming an electronically programmable semiconductor fuse (2010-07-13),

11. 7446005 - Manufacturable recessed strained RSD structure and process for advanced CMOS (2008-11-04),

12. 7368393 - Chemical oxide removal of plasma damaged SiCOH low k dielectrics (2008-05-06),

13. 7153738 - Method for making a trench memory cell (2006-12-26),

14. 7115955 - Semiconductor device having a strained raised source/drain (2006-10-03),

15. 6995094 - Method for deep trench etching through a buried insulator layer (2006-02-07),

Title: The Innovative Journey of Brian W Messenger

Introduction: Inventor Brian W Messenger, based in Newburgh, NY (US), has made significant contributions to the field of technology with a total of 16 patents to his name.

Latest Patents: Messenger's latest patents include a groundbreaking method for voltage contrast inspection of deep trench isolation. This method involves forming test structures with deep trenches filled with conductive material and measuring voltages across inner and outer buried plates immediately after the isolation structure is formed.

Career Highlights: Brian W Messenger has showcased his inventive prowess while working at renowned companies such as IBM (International Business Machines Corporation) and Globalfoundries Inc. His expertise and dedication have led to the development of pioneering technologies in the semiconductor industry.

Collaborations: Throughout his career, Messenger has collaborated with esteemed professionals in the field, including coworkers like Joseph Ervin and Karen A Nummy. These collaborations have played a vital role in the success of his innovative projects.

Conclusion: In conclusion, Brian W Messenger's remarkable journey as an inventor reflects his passion for pushing the boundaries of technology. His patents and collaborations stand as a testament to his ingenuity and unwavering commitment to driving innovation forward.

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1 patent pending:

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