The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2014

Filed:

Nov. 26, 2013
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Joseph Ervin, Wappingers Falls, NY (US);

Brian Messenger, Newburgh, NY (US);

Karen A. Nummy, Newburgh, NY (US);

Ravi M. Todi, Coste Jardin Del Mar, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 29/66 (2006.01); H01L 29/94 (2006.01); H01L 27/12 (2006.01); H01L 21/84 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 28/60 (2013.01); H01L 29/66181 (2013.01); H01L 29/945 (2013.01); H01L 27/1203 (2013.01); H01L 21/84 (2013.01);
Abstract

Deep trench capacitor structures and methods of manufacture are disclosed. The method includes forming a deep trench structure in a wafer including a substrate, buried oxide layer (BOX) and silicon (SOI) film. The structure includes a wafer including a substrate, buried insulator layer and a layer of silicon on insulator layer (SOI) having a single crystalline structure throughout the layer. The structure further includes a first plate in the substrate and an insulator layer in direct contact with the first plate. A doped polysilicon is in direct contact with the insulator layer and also in direct contact with the single crystalline structure of the SOI.


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