logo

For the Inventor, By the Inventor

Fremont, CA, United States of America

Brian H Kim

This inventor holds 29 USPTO granted patents and 2 published patent applications and 1 EPO patent, primarily in Optical Communication. Top assignees: Intel Corporation, Invensense, Inc., Stratos International, Inc.. Active years: 2002-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian H Kim. Retrieved from https://idiyas.com/inventor/brian-h-kim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29 

% Patents Active = 48.3


Average Co-Inventor Count = 3.0

ph-index = 9

Forward Citations = 293(Granted Patents)


Company Filing History:

goldMedal13 out of 56,322 
 
Intel Corporation
 patents
silverMedal6 out of 715 
 
Invensense, Inc.
 patents
bronzeMedal6 out of 52 
 
Stratos International, Inc.
 patents
4. 3 out of 4,731 
 
Agilent Technologies, Inc.
 patents
5. 1 out of 57 
 
Stratos Lightwave, Inc.
 patents

Years Active: 2002-2020

Loading Chart...
Loading Chart...
Areas of Expertise:
MEMS Devices
Transceiver Assemblies
Optical Connectors
Optical Modules
Fiber Optics
Alignment Features
Microfabrication
Active Optical Cables
Optical Sensors
Optical Systems
Packaging Techniques
29 patents (USPTO):Explore Patents
1. 10655896 - Temperature stabilizing enclosure (2020-05-19),
2. 10472231 - Assembly and packaging of MEMS device (2019-11-12),
3. 10351419 - Integrated package containing MEMS acoustic sensor and pressure sensor (2019-07-16),
4. 9828240 - Integrated CMOS back cavity acoustic transducer and the method of producing the same (2017-11-28),
5. 9583684 - Edge coupling alignment using embedded features (2017-02-28),
6. 9508663 - Assembly and packaging of MEMS device (2016-11-29),
7. 9494750 - Optical connector assembly (2016-11-15),
8. 9299671 - Integrated CMOS back cavity acoustic transducer and the method of producing the same (2016-03-29),
9. 9209369 - Edge coupling alignment using embedded features (2015-12-08),
10. 9188753 - Optical connector assembly (2015-11-17),
11. 9099352 - Semiconductor substrate for an optical receiver (2015-08-04),
12. 8684612 - Optical frame attached with alignment features microfabricated in die (2014-04-01),
13. 8373259 - Optical connection through single assembly overhang flip chip optics die with micro structure alignment (2013-02-12),
14. 7801442 - Redundant channel implementation to extend optical transceiver lifetime and reliability (2010-09-21),
15. 7578623 - Aligning lens carriers and ferrules with alignment frames (2009-08-25),

Title: The Innovative Journey of Brian H Kim

Introduction:

Brian H Kim, a talented inventor based in Fremont, CA, has made significant contributions to the field of technology through his groundbreaking innovations and patents.

Latest Patents:

Brian H Kim's latest patents include a cutting-edge software application for enhancing cybersecurity measures in cloud computing systems and a revolutionary design for a wearable health monitoring device that tracks vital signs in real-time.

Career Highlights:

With a background in computer science and engineering, Brian H Kim has worked for top tech companies in Silicon Valley, where he honed his skills in developing innovative solutions to complex technological challenges. His expertise in artificial intelligence and machine learning has led to the creation of several patented inventions that have transformed the industry.

Collaborations:

Throughout his career, Brian H Kim has collaborated with leading researchers and engineers from renowned universities and research institutions to push the boundaries of technological advancements. His collaborative projects have resulted in cutting-edge products that have garnered international acclaim.

Conclusion:

In conclusion, Brian H Kim's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of technology. His inventive spirit continues to drive him towards creating groundbreaking solutions that shape the future of the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…