Intel Corporation

Invensense, Inc.

Stratos International, Inc.

Agilent Technologies, Inc.

Stratos Lightwave, Inc.

Brian H Kim

Darren S Crews

Lee Xu

Jesse Chin

Hengju Cheng

William H Wang

Simon S Lee

Mozafar Maghsoudnia

Yousheng Wu

Haijun She

Xiaojie J Xu

Anthony D Minervini

Michael Julian Daneman

Fang Liu

Kendra J Gallup

Jennie Lou H De Quinto

John Heck

Ansheng Liu

George R Hayek

Peter George Hartwell

Thomas Gerard Willis

An-Chun Tien

Miaobin Gao

Graham Flower

Jia Gao

Sylvia Downing

Chien-Chang Liu

James-Yu Chang

Guobin Liu

Simon Lee, Ii

Frank Wang

Muhammad Maaz Qazi

Thiri Lwin

Wei-zen Lo

A device includes a substrate, a micro-electro-mechanical system (MEMS) device disposed on the substrate, a controller disposed on the substrate, a heating element, and an enclosure. The heating element is configured to generate heat in response to a signal generated by the controller. The enclosure encloses the MEMS sensor device, the controller, and the heating element. The controller is configured to generate the signal responsive to temperature measurements within the enclosure. The signal causes the heating element to generate heat and maintain a predetermined temperature within the enclosure.

Temperature stabilizing enclosure

A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.

Assembly and packaging of MEMS device

Integrated microelectromechanical systems (MEMS) acoustic sensor devices are disclosed. Integrated MEMS acoustic sensor devices can comprise a MEMS acoustic sensor element and a pressure sensor within the back cavity associated with the MEMS acoustic sensor element. Integrated MEMS acoustic sensor devices can comprise a port adapted to receive acoustic waves or pressure. Methods of fabrication are also disclosed.

Integrated package containing MEMS acoustic sensor and pressure sensor

A MEMS device includes a MEMS substrate with a movable element. Further included is a CMOS substrate with a cavity, the MEMS substrate disposed on top of the CMOS substrate. Additionally, a back cavity is connected to the CMOS substrate, the back cavity being formed at least partially by the cavity in the CMOS substrate and the movable element being acoustically coupled to the back cavity.

Integrated CMOS back cavity acoustic transducer and the method of producing the same

Methods and systems may provide an alignment scheme for components that may reduce positional deviation between the components. The method may include placing a first component on top of a substrate, wherein the first component includes a receiving alignment feature, and coupling a second component to the first component, wherein the coupling includes inserting a protruding alignment feature of the second component into the receiving alignment feature of the first component. In one example, the first component includes an edge-emitting semiconductor die and the second component include one or more of an optical lens and an alignment frame.

Edge coupling alignment using embedded features

Methods, apparatuses, and systems related to optical connector assemblies are described. In some embodiments, the connector assemblies may include an optical assembly, having an optical interconnect and an optical module, to be coupled with a host electrical connector. The connector assembly may further include springs, disposed on the optical interconnect or the host electrical connector, to facilitate a coupling of the optical interconnect with the optical module. Other embodiments are described and claimed.

Optical connector assembly

Embodiments of the present disclosure describe semiconductor substrate techniques and configurations for an optical receiver. In one embodiment, a system includes a semiconductor substrate having one or more optical alignment features formed in a surface of the semiconductor substrate and an optical receiver assembly coupled with the semiconductor substrate, the optical receiver assembly including a photodetector device coupled with the surface of the semiconductor substrate, wherein the one or more optical alignment features facilitate precise optical alignment between a lens assembly and the photodetector device when the lens assembly is coupled with the semiconductor substrate using the one or more optical alignment features. Other embodiments may be described and/or claimed.

Semiconductor substrate for an optical receiver

A photonic device assembly including a photonic device fabricated on a chip substrate, the chip substrate having a physical alignment feature fabricated therein, and a frame to couple an external optical lens or interconnect to the photonic device. The frame has a frame facet abutted to a complementary facet of the physical alignment feature. An adhesive permanently affixes the frame to the photonic device as aligned by the abutted facets. A method of forming a photonic device assembly includes microfabricating a physical alignment feature in a chip substrate of a photonic device and joining a frame to the chip substrate by abutting a facet of the coupling to a complementary facet of the fabricated physical alignment feature.

Optical frame attached with alignment features microfabricated in die

A system includes an optical transceiver assembly, including a flip chip connection of a semiconductor die with a photonic transceiver that overhangs a substrate to which it is to be connected. The assembly further includes an alignment pin that is held to the semiconductor die at a micro-engineered structure in the semiconductor die. The alignment pin provides passive alignment of the photonic transceiver with an optical lens that interfaces the photonic transceiver to one or more optical channels.

Optical connection through single assembly overhang flip chip optics die with micro structure alignment

Embodiments introduce redundant optical channels to significantly extend the lifetime of parallel optical transceivers. A plurality of transmitters, N, transmit on a plurality of optical channels, where N is an integer number of optical channels greater than 1. One or more redundant channels, M, are also provided. N+M multiple input shift registers provide multiple paths for signals from each of the transmitters to connect to N+M laser diodes. In the event up to M of the N+M laser diodes fail, the multiple input shift registers connect the N transmitters to functioning ones of the N+M laser diodes thus extending the life of the device. A corresponding scheme is also described for the receiver side.

Redundant channel implementation to extend optical transceiver lifetime and reliability

Methods of aligning lens carriers and ferrules with alignment frames during assembly of optical cable connectors are disclosed. In one aspect, a method may include coupling an alignment frame with a circuit substrate, aligning a lens carrier with the alignment frame, and aligning a ferrule with the alignment frame. Other methods, apparatus, and systems incorporating the apparatus are also disclosed.

Aligning lens carriers and ferrules with alignment frames

Growing community of inventors

Fremont, CA, United States of America

Brian H Kim