The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2019
Filed:
May. 20, 2016
Applicant:
Invensense, Inc., San Jose, CA (US);
Inventors:
Jia Gao, Winchester, MA (US);
Brian Kim, Fremont, CA (US);
Peter George Hartwell, Menlo Park, CA (US);
Mozafar Maghsoudnia, San Jose, CA (US);
Assignee:
INVENSENSE, INC., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/02 (2006.01); B81C 1/00 (2006.01); H04R 1/04 (2006.01); H04R 1/02 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
B81B 7/02 (2013.01); B81C 1/0023 (2013.01); B81C 1/00277 (2013.01); B81C 1/00285 (2013.01); H01L 23/10 (2013.01); H04R 1/028 (2013.01); H04R 1/04 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/0264 (2013.01); B81B 2207/012 (2013.01); B81B 2207/098 (2013.01); H01L 2224/05014 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/16152 (2013.01);
Abstract
Integrated microelectromechanical systems (MEMS) acoustic sensor devices are disclosed. Integrated MEMS acoustic sensor devices can comprise a MEMS acoustic sensor element and a pressure sensor within the back cavity associated with the MEMS acoustic sensor element. Integrated MEMS acoustic sensor devices can comprise a port adapted to receive acoustic waves or pressure. Methods of fabrication are also disclosed.