The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2017
Filed:
Feb. 18, 2016
Applicant:
Invensense, Inc., San Jose, CA (US);
Inventors:
Fang Liu, San Jose, CA (US);
Michael Julian Daneman, Campbell, CA (US);
Brian Kim, Fremont, CA (US);
Anthony Minervini, Palos Hills, IL (US);
Assignee:
INVENSENSE, INC., San Jose, CA (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); B81C 1/00 (2006.01); H01L 29/00 (2006.01); H01L 21/00 (2006.01); H04R 19/04 (2006.01); H01L 29/84 (2006.01); H01L 27/092 (2006.01); H01L 23/00 (2006.01); H04R 19/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00238 (2013.01); B81C 1/00309 (2013.01); H01L 24/05 (2013.01); H01L 27/092 (2013.01); H04R 19/005 (2013.01); B81B 3/0018 (2013.01); B81B 2201/0257 (2013.01); B81C 2203/0792 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12042 (2013.01);
Abstract
A MEMS device includes a MEMS substrate with a movable element. Further included is a CMOS substrate with a cavity, the MEMS substrate disposed on top of the CMOS substrate. Additionally, a back cavity is connected to the CMOS substrate, the back cavity being formed at least partially by the cavity in the CMOS substrate and the movable element being acoustically coupled to the back cavity.