The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
Jul. 24, 2013
Applicant:
Invensense, Inc., Sunnyvale, CA (US);
Inventors:
Brian H. Kim, Fremont, CA (US);
Haijun She, San Jose, CA (US);
Mozafar Maghsoudnia, San Jose, CA (US);
Assignee:
INVENSENSE, INC., San Jose, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B81C 1/00 (2006.01); B81B 3/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/06 (2013.01); B81B 3/001 (2013.01); B81B 7/0032 (2013.01); B81C 1/00238 (2013.01); B81C 1/00261 (2013.01); H01L 24/04 (2013.01); H01L 24/75 (2013.01); B81B 2207/012 (2013.01); B81B 2207/093 (2013.01); B81C 2203/019 (2013.01);
Abstract
A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.