The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

Dec. 03, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Brian H. Kim, Fremont, CA (US);

Simon Lee, San Jose, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 33/58 (2010.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/58 (2013.01); H01L 23/544 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 2223/5448 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/81139 (2013.01); H01L 2224/81141 (2013.01); H01L 2224/8314 (2013.01); H01L 2224/83139 (2013.01); H01L 2224/83141 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/14 (2013.01); H01L 2933/0058 (2013.01);
Abstract

Methods and systems may provide an alignment scheme for components that may reduce positional deviation between the components. The method may include placing a first component on top of a substrate, wherein the first component includes a receiving alignment feature, and coupling a second component to the first component, wherein the coupling includes inserting a protruding alignment feature of the second component into the receiving alignment feature of the first component. In one example, the first component includes an edge-emitting semiconductor die and the second component include one or more of an optical lens and an alignment frame.


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