Bok Hoen Kim

This inventor holds 77 USPTO granted patents and 22 published patent applications, primarily in Plasma Processing (CPC class H01L). Top assignee: Applied Materials, Inc.. Active years: 2002-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bok Hoen Kim. Retrieved from https://idiyas.com/inventor/bok-hoen-kim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 77 (Patent Applications = 22)

% Patents Active = 77.9

Average Co-Inventor Count = 7.0

ph-index = 14

Forward Citations = 1,579(Granted Patents)

Forward Citations (Not Self Cited) = 1,494(Dec 10, 2025)

Inventors with similar research interests:

Location History:

San Jose, CA (US) (2002 - 2023)
Santa Clara, CA (US) (2024)

Company Filing History:

77 out of 14,502

Applied Materials, Inc.

patents

Years Active: 2002-2025

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Areas of Expertise:

Plasma Processing

PECVD Techniques

Boron-Carbon Films

3D NAND Memory

Dielectric-Metal Stacks

Conformal Carbon Films

Vertical Etch Performance

Wafer Processing

Lithographic Overlay

Advanced Patterning

Electrostatic Chucking

Gas Flow Control

77 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12211694 - Ultra-high modulus and etch selectivity boron-carbon hardmask films (2025-01-28),

2. 11898249 - PECVD process (2024-02-13),

3. 11728168 - Ultra-high modulus and etch selectivity boron-carbon hardmask films (2023-08-15),

4. 11613812 - PECVD process (2023-03-28),

5. 11365476 - Plasma enhanced chemical vapor deposition of films for improved vertical etch performance in 3D NAND memory devices (2022-06-21),

6. 11276562 - Plasma processing using multiple radio frequency power feeds for improved uniformity (2022-03-15),

7. 10971364 - Ultra-high modulus and etch selectivity boron carbon hardmask films (2021-04-06),

8. 10793954 - PECVD process (2020-10-06),

9. 10688538 - Aluminum fluoride mitigation by plasma treatment (2020-06-23),

10. 10580623 - Plasma processing using multiple radio frequency power feeds for improved uniformity (2020-03-03),

11. 10510518 - Methods of dry stripping boron-carbon films (2019-12-17),

12. 10483282 - VNAND tensile thick TEOS oxide (2019-11-19),

13. 10475644 - Dielectric-metal stack for 3D flash memory application (2019-11-12),

14. 10418243 - Ultra-high modulus and etch selectivity boron-carbon hardmask films (2019-09-17),

15. 10403535 - Method and apparatus of processing wafers with compressive or tensile stress at elevated temperatures in a plasma enhanced chemical vapor deposition system (2019-09-03),

Sure, I can help you with that! Here is the article about the inventor Bok Hoen Kim:

Title: Innovation Extraordinaire: The Remarkable Work of Bok Hoen Kim in Semiconductor Fabrication

Introduction:

Pioneering the way forward in semiconductor fabrication, Bok Hoen Kim has made a significant impact in the field of integrated circuits. With 75 patents to his name, Kim's work at Applied Materials, Inc. in San Jose, CA, has been instrumental in advancing cutting-edge technologies.

Latest Patents:

Among his recent patents is the groundbreaking "Ultra-high modulus and etch selectivity boron-carbon hardmask films." This patent showcases techniques for depositing boron-carbon films on a substrate with specific elastic modulus and stress levels, crucial for integrated circuit fabrication. Additionally, Kim's work on the "PECVD process" highlights methods to enhance substrate temperature profiles and plasma density for improved deposition rates and quality.

Career Highlights:

Bok Hoen Kim's career is highlighted by his innovative contributions to semiconductor manufacturing processes. His expertise in optimizing deposition processes and material properties has propelled advancements in the industry. Through a combination of technical skill and creativity, Kim continues to push the boundaries of what is possible in semiconductor technology.

Collaborations:

Kim's collaborative spirit is evident through his work with notable colleagues such as Ganesh Balasubramanian and Deenesh Padhi. Together, they have fostered a culture of innovation at Applied Materials, Inc., driving forward-thinking solutions in semiconductor fabrication.

Conclusion:

In conclusion, Bok Hoen Kim stands as a beacon of innovation in the realm of semiconductor fabrication. His relentless pursuit of excellence and dedication to pushing the limits of technology have solidified his position as a pioneering figure in the industry. As he continues to innovate and inspire, Kim's impact will undoubtedly shape the future of integrated circuits and beyond.

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Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

22 patents pending: