Bok Gyu Min

USPTO Granted Patents = 12 (Patent Applications = 4)

Average Co-Inventor Count = 2.3

ph-index = 1

Forward Citations = 4(Granted Patents)

Location History:

Gyeonggi-do, KR (2012)
Chungcheongbuk-do, KR (2014)
Incheon-si, KR (2016)
Icheon-si, KR (2013 - 2024)

Company Filing History:

Hynix Semiconductor Inc.

patents

Years Active: 2012-2024

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12 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12033952 - Semiconductor packages including at least one die position checker (2024-07-09),

2. 11769700 - Semiconductor substrate, semiconductor package including semiconductor substrate, and test method of semiconductor substrate (2023-09-26),

3. 11764160 - Semiconductor packages including at least one die position checker (2023-09-19),

4. 11239177 - Semiconductor packages including die over-shift indicating patterns (2022-02-01),

5. 10692816 - Semiconductor packages including die over-shift indicating patterns (2020-06-23),

6. 10312196 - Semiconductor packages including indicators for evaluating a distance and methods of calculating the distance (2019-06-04),

7. 9412716 - Semiconductor package and method for manufacturing the same (2016-08-09),

8. 8907490 - Semiconductor packages having the first and second chip inclined sidewalls contact with each other (2014-12-09),

9. 8624375 - Semiconductor package for selecting semiconductor chip from a chip stack (2014-01-07),

10. 8525319 - Selecting chips within a stacked semiconductor package using through-electrodes (2013-09-03),

11. 8304879 - Spiral staircase shaped stacked semiconductor package and method for manufacturing the same (2012-11-06),

12. 8242582 - Semiconductor package and stacked semiconductor package having the same (2012-08-14),

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4 patents pending:

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