The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2014
Filed:
Sep. 14, 2012
Applicants:
SO Hyun Jung, Busan, KR;
Bok Gyu Min, Chungcheongbuk-do, KR;
Inventors:
So Hyun Jung, Busan, KR;
Bok Gyu Min, Chungcheongbuk-do, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/02 (2006.01); H01L 23/04 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
Abstract
Semiconductor packages are provided. The semiconductor package includes a first chip having a first inclined sidewall in an edge of the first chip; and a second chip having a second inclined sidewall in an edge of the second chip and the second chip being horizontally adjacent to the first chip such that the first and second inclined sidewalls are in substantial contact with each other.
Jung, So. (2014). Semiconductor packages having the first and second chip inclined sidewalls contact with each other (U.S. Patent No. 8907490). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8907490
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile