For the Inventor, By the Inventor

Enter inventor name

Seongnam-si, South Korea

So Hyun Jung

USPTO Granted Patents = 5

Average Co-Inventor Count = 2.2

ph-index = 1

Location History:

Busan, KR (2014 - 2017)
Seongnam-si, KR (2020 - 2021)
Seongnam-si Gyeonggi-do, KR (2023)

Company Filing History:

5 out of 11,026

Years Active: 2014-2023

Loading Chart...

5 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11557523 - Semiconductor packages and methods of forming the semiconductor packages (2023-01-17),

2. 10950512 - Semiconductor packages including a semiconductor chip and methods of forming the semiconductor packages (2021-03-16),

3. 10879160 - Semiconductor package with packaging substrate (2020-12-29),

4. 9536861 - Semiconductor package including a plurality of stacked chips (2017-01-03),

5. 8907490 - Semiconductor packages having the first and second chip inclined sidewalls contact with each other (2014-12-09),

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com

Loading…