The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2014
Filed:
Dec. 29, 2010
Bok Gyu Min, Icheon-si, KR;
Joon Ki Hong, Icheon-si, KR;
Tae Hoon Kim, Icheon-si, KR;
Da Un Nah, Seoul, KR;
Jae Joon Ahn, Icheon-si, KR;
Ki Bum Kim, Icheon-si, KR;
Bok Gyu Min, Icheon-si, KR;
Joon Ki Hong, Icheon-si, KR;
Tae Hoon Kim, Icheon-si, KR;
Da Un Nah, Seoul, KR;
Jae Joon Ahn, Icheon-si, KR;
Ki Bum Kim, Icheon-si, KR;
SK Hynix Inc., Gyeonggi-do, KR;
Abstract
A semiconductor package includes: first, second, third and fourth semiconductor chips stacked while having the arrangement of chip selection vias; and a connection unit provided between a second semiconductor chip and a third semiconductor chip, and configured to mutually connect some of the chip selection vias of the second and third semiconductor chips and disconnect the others of the chip selection vias of the second and third semiconductor chips, wherein the first and second semiconductor chips and the third and fourth semiconductor chips are stacked in a flip chip type.